MICA Freeform™ offers significantly greater precision, tighter tolerances (measured in microns) and smaller features than any other micro-machining technology currently available. And unlike these traditional technologies, MICA Freeform™ also offers embedded features (including blind pockets, vias, counterbores and identification) as well as complex mechanisms — all within the same wafer-scale process.

Case Study:
Ultra High Precision™ Parts

The objective of this demonstration is to show the lower limits of micro-hole manufacturing in a side-by-side comparison using conventional processes of EDM, Laser, PCM and the Mica Freeform Process (MFP).

Figure 1.
Smallest hole each technology can produce

A standardized aperture plate provided the basis for this comparison by showing the minimum hole size for each process.

Figure 2.
hole size comparison

The results show MFP's superior capabilities for creating high quality cylindrical micro-holes 2 to 3 times smaller than those produced by Laser and EDM.

Figure 3.
MICA Freeform™ with embedded features

MFP's embedded features capability moves beyond conventional process technology by providing stepped hole features.

 

Case Study (Download PDF)